Kester
Wins A 2006 Global Technology Award for Ultrapure® K100LD
Kester
announces that it has been awarded a Global Technology Award
in the category of Environmentally Friendly Products/Services
for its innovative UltraPure® K100LD, a lead-free bar
solder alloy for the electronics industry. The award was presented
by Global SMT & Packaging Magazine’s Publisher and Editor-in-Chief
Trevor Galbraith during a Wednesday, September 27, 2006 ceremony
that took place at the Sofitel Hotel during the Assembly Technology
Exposition.
K100LD
is a patent-pending, low-cost alternative to traditional lead-free
alloys. The bar solder offers the lowest copper dissolution
of any lead-free bar on the market, even amongst all common
alloys, including Sn63, SAC305 and other lead-free options.
K100LD
represents an improvement over competitive alloys, including
other variations of Tin-Copper-Nickel (SnCuNi). K100LD is
a low-cost (silver-free) lead-free alloy primarily containing
tin and copper with the inclusion of metallic dopants to control
the grain structure and the Copper dissolution rate. K100LD
has a slower rate of Copper dissolution than competitive SnCuNi
alloys, which minimizes pot maintenance, maintains consistent
soldering performance and improves reliability. K100LD has
a copper dissolution rate 20 percent slower than the competitive
SnCuNi alloy and even Sn63Pb37. K100LD compares favorably
to other low-cost, lead-free alloys of tin and copper in terms
of wetting and flow characteristics, providing users with
optimal soldering performance and minimal defects.
K100LD
is a Silver-free alloy, resulting in much lower costs than
traditional lead-free alloys, such as SAC305. Kester K100LD
provides the lowest delivered price to the global wave soldering
market. K100LD includes anti-drossing technology, an important
attribute with lead-free soldering that also represents additional
cost savings to the assembler.
Besides
offering the lowest dissolution of copper from boards and
components of any lead-free alloy, K100LD offers numerous
benefits, including bright, smooth solder joints with no visible
shrinkage effects, excellent through-hole penetration and
topside fillet with virtually no bridging, and reduced leaching
of solder pot materials. Additionally, K100LD is compatible
with all types of board and component metallizations, is compatible
with other SnCuNi alloys, and its lead level is specified
at less than 0.05 percent, ensuring RoHS compliance.
