Features:
• Maximum routing and grounding flexibility
• Lower insertion/extraction forces vs. typical array products
• 56 Gbps PAM4 performance
• Up to 560 I/Os in open pin field design
• 1.27 mm (.050") pitch
• Rugged Edge Rate® contact system
• Current rating: 2.7 A max
• Voltage rating: 240 VAC/ 339 VDC max
• Can be “zippered” during mating/unmating
• Solder charge terminations for ease of processing
• Meets Extended Life Product™ (E.L.P.™) standards
• Analog Over Array™ capable
• 7–18.5 mm stack heights
• Vertical, right-angle, press-fit
• Elevated systems to 40 mm
• 85 Ω systems
• Standards: VITA™ 47, VITA™ 57.1 FMC™, VITA™ 57.4 FMC+™, VITA™ 74 VNX™, PISMO™ 2
• IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
•IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
• Samtec's Severe Environment Tested (SET) qualified product
• Extended Life Product™ certified to 5,000 cycles and 150º operating temperature with SureCoat™ palladium nickel with gold flash plating

Applications:
• Industrial
• Military/Aerospace
• Datacom
• Computer & Semiconductor
• Test Connectivity
• Medical
• Instrumentation
• Automotive