530614B00000G
Boyd Laconia LLCThe 530614B00000G is an aluminum, channel-style board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices. ...
DESCRIPTION
The 530614B00000G is a board-level channel heat sink intended for the thermal management of TO-220 and TO-220-single gauge packaged devices. Constructed from aluminum with a black anodize finish, this heat sink has a height of 29.97 mm, a width of 25.40 mm, and a length of 12.70 mm. It can be mounted either horizontally or vertically, offering design flexibility. Based on performance data, it provides a thermal resistance of approximately 10 °C/Watt under natural convection. This RoHS compliant component is ideal for applications requiring efficient heat dissipation from power transistors and voltage regulators in a compact footprint.
Search Keywords: 530614B00000G
SPECIFICATIONS
IN STOCK: 3,526
Can Ship immediately
Minimum Order Quantity: 10
Factory Lead-Time 6 Weeks
Price (USD)
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