530614B00000G by boyd laconia llc
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Boyd Laconia LLC Authorized Distributor

530614B00000G

The 530614B00000G is an aluminum, channel-style board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices. ...

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RoHS Compliant
Bulk Packaging
Accessories
Certificate of Compliance

DESCRIPTION

The 530614B00000G is a board-level channel heat sink intended for the thermal management of TO-220 and TO-220-single gauge packaged devices. Constructed from aluminum with a black anodize finish, this heat sink has a height of 29.97 mm, a width of 25.40 mm, and a length of 12.70 mm. It can be mounted either horizontally or vertically, offering design flexibility. Based on performance data, it provides a thermal resistance of approximately 10 °C/Watt under natural convection. This RoHS compliant component is ideal for applications requiring efficient heat dissipation from power transistors and voltage regulators in a compact footprint.

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SPECIFICATIONS

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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
530614B00000G
Alias/AKA:
001725
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8473309000
COO:
CN
ECCN:
EAR99
Supplier's Standard Package: The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution.
2000
Package Type:
Bulk
Device Cooled:
TO-220
Attachment Method:
Screw
Dimension:
25.4 x 29.97 x 12.7 mm
Thermal Resistance:
16.7 °C/W
Finish:
Black Anodized

IN STOCK: 2,026

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Minimum Order Quantity: 10

Factory Lead-Time 6 Weeks

Price (USD)

Qty
Unit Price
10
$3.09
50
$2.76
250
$2.51
500
$2.39
2,000
$1.62
4,000 +
$1.61
Supplier's Standard Package
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