Aries Electronics, Inc.
Aries Electronics, Inc. has founded by Bill Sinclair in 1972 when he bought the back panel line from Thomas & Betts Corp. including IC sockets, headers and printed circuit cards. Developing industry-standard and proprietary connector products, the company expanded and became known as the go to source for unique connector products that solved a variety of interconnection and packaging problems.
Aries Electronics is based in Bristol, Pennsylvania and manufactures IC interconnection products for electronics applications, including several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; a full line of Test (high frequency >60 GHz) and Burn-in sockets for virtually any device, Correct-A-Chip® product line of "intelligent connectors" (incorporating other components, both passive and active), adapters (connectors that allow the use of one termination or signal routing style on a board designed for a different termination or signal routing style ), and multi-chip modules (MCMs), including wire bonding capabilities; ZIF (Zero-Insertion-Force) test sockets for DIP, PGA, PLCC and SOIC devices; DIP, SIP and special purpose sockets, headers and covers; programmable devices; jumper and cable assemblies; flexible cable products; square pin connectors; and specialty electronic connectors.
Aries is the recognized industry leader in ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC devices, and continues to be a leading source for a wide variety of specialty electronic connectors.
In recent years, the company has made major inroads in the market for high-temperature sockets and flexible cable products. The addition of the Correct-A-Chip® product line established the company as a major source for "intelligent connectors" (incorporating other components, both passive and active), adapters (connectors that allow the use of one termination style on a board designed for a different termination style).
Most recently, the company has developed and patented several concepts for BGA (ball grid array) and LGA (land grid array) sockets, and has acquired a high-frequency test and burn-in socket line, furthering growth in the test socket market.