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25LC256-I/ST by Microchip Technology
DATA SHEET

25LC256-I/ST

Microchip Technology

EEPROM - Serial-SPI - 256Kb (32K x 8) - 3.3V/5V - 8-Pin TSSOP - Tube .. see full description

  • RoHS Compliant
  • TUBE Packaging
  • Accessories
  • Set Notification
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Supplier:
Microchip Technology
Part No:
25LC256-I/ST
RoHS:
Yes
HTS:
8542320051
COO:
TH
ECCN:
EAR99
Supplier Standard Pack:
5000
Package Type:
TUBE
Data Retention:
200(Min) Year
The MICROCHIP TECH. part 25LC256-I/ST is an EEPROM memory chip with a capacity of 256Kb, or 32K x 8, suitable for use in various applications. It operates at voltages of 3.3V or 5V, offering versatility in different circuit designs. The chip utilizes a Serial-SPI interface for easy integration into existing systems. Encased in an 8-Pin TSSOP package, this chip provides a compact solution while maintaining reliable performance. It is supplied in a tube packaging, ensuring safe transportation and storage.
Search Keywords:
25LC256IST
  Different packaging options available.  See Alternatives
IN STOCK: 2,150
Can Ship immediately
Minimum Order:
100
Multiple:
100
Factory Lead-Time
20 Weeks
Enter Quantity
Price (CAD)
Quantity
Unit Price
Ext. Price
100
$2.158
$215.827
300
$2.135
$640.527
500
$2.125
$1,062.475
1,000
$2.115
$2,114.810
2,500
$2.103
$5,258.055
5,000
$2.093
$10,465.413
7,500
$2.083
$15,622.073
10,000 +
$2.073
$20,728.035
Click for Quote
DOWNLOADS
PDF Datasheet
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PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 03-Jun-2004 - QUALIFY UNISEM MALAYSIA FOR ASSEMBLY OF 8L TSSOP PACKAGE FOR PB-FREE RELEASE
PDF PCN - 17-Jan-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 19-Mar-2007 -
PDF PCN - 02-Nov-2007 - CHANGE IN BOM
PDF PCN - 28-Jun-2005 - NEW LEADFRAME SUPPLIER FOR 8L SOIC .150
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 12-Jan-2017 - FINAL NOTICE - QUALIFICATION OF 35.8K PROCESS TECHNOLOGY FOR SELECTED PRODUCTS
PDF PCN - 12-Apr-2012 - QUALIFICATION OF 8L TSSOP PACKAGE AT MMT (ALPH) ASSEMBLY SITE
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 19-Mar-2007 - QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 08-Jan-2013 - DATA SHEET - 25AA256/25LC256 DEVICE DATA SHEET
PDF PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 06-Dec-2016 - INITIAL NOTICE- QUALIFICATION OF 35.8K PROCESS TECHNOLOGY FOR SELECTED PRODUCTS
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 08-Jan-2013 - Microchip has released a new devicedoc for the 25AA256/25LC256 device data sheet of devices.
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 23-Jul-2021 - DATA SHEET - 25AA256/25LC256 256K SPI BUS SERIAL EEPROM
PDF PCN - 09-Sep-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS OF 160K AND 150K
PDF PCN - 15-Jun-2012 - QUALIFICATION OF 8L TSSOP PACKAGE AT MMT (ALPH) ASSEMBLY SITE
PDF PCN - 13-Jul-2006 -
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 28-Aug-2019 - MICROCHIP HAS RELEASED A NEW PRODUCT DOCUMENTS FOR THE 25AA256/25LC256 DEVICE DATA SHEET OF DEVICES
PDF PCN - 15-Oct-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS OF 160K AND 150K
PDF PCN - 12-Apr-2012 - Microchip is announcing the qualification of MMT (ALPH) assembly site for the listed 8L TSSOP packag
PDF PCN - 28-Mar-2022 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH BOND WIRE FOR SELECTED PRODUCTS
PDF PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 15-Jun-2012 - QUALIFICATION OF 8L TSSOP PACKAGE AT MMT (ALPH) ASSEMBLY SITE
PDF PCN - 27-Sep-2004 - All standard Microchip devices in the listed packages will change from SnPbplating (standard tin-lea
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 27-Sep-2004 - CHANGE FROM SNPB PLATING TO MATTE TIN PLATING (INDUSTRY-STANDARD PURE SN) OF THE DEVICE LEADS
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 26-May-2005 - QUALIFICATION OF 8L SOIC PACKAGE IN STRIP MAGAZINE FORM AT HANA
PDF PCN - 05-Oct-2007 - Qualification of G700 mold compound in TSSOP packages at ATP!
PDF PCN - 03-Jun-2004 -
PDF PCN - 24-Jan-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 18-Jul-2005 - QUALIFICATION OF 8L DFN-S WITH G770HCD MOLD COMPOUND AND 8200T DIE ATTACH EPOXY
PDF PCN - 01-Feb-2006 -
PDF PCN - 19-Apr-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 25-Sep-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 18-Sep-2018 - 25LCXXX 8K-256K SPI SERIAL EEPROM HIGH TEMP FAMILY DATA SHEET
PDF PCN - 06-Dec-2016 - INITIAL NOTICE- QUALIFICATION OF 35.8K PROCESS TECHNOLOGY FOR SELECTED PRODUCTS
PDF PCN - 08-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 13-Jul-2006 - QUALIFICATION OF 8L TSSOP AT VGT
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 06-Mar-2006 - QUALIFICATION OF NEW PLATING SITE FOR SNPB & MATTE TIN PLATING
PDF PCN - 06-Mar-2006 -
PDF PCN - 11-Nov-2004 -
PDF PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT
PDF PCN - 12-Jan-2017 - FINAL NOTICE - QUALIFICATION OF 35.8K PROCESS TECHNOLOGY FOR SELECTED PRODUCTS
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 02-Sep-2011 - Microchip is announcing the qualification of the listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f
PDF PCN - 09-Sep-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS OF 160K AND 150K
PDF PCN - 15-Mar-2022 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE
PDF PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse
PDF PCN - 07-Oct-2005 - 8L SOIJ 208'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

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