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I/O Expanders
MCP23S17-E/SP

MCP23S17-E/SP by microchip technology

Image is representational - see mfr. specs

MCP23S17-E/SP

Microchip Technology

The MCP23S17-E/SP is a 16-bit remote bidirectional I/O expander with a high-speed SPI interface. ...

RoHS Compliant

TUBE Packaging

Accessories

Certificate of Compliance Guarantee

DESCRIPTION

The MCP23S17-E/SP is a 16-bit, general-purpose parallel I/O expander that provides I/O expansion for SPI applications. It features a high-speed SPI interface with a maximum clock frequency of 10 MHz and 16 bidirectional I/O pins that default to inputs. The device includes configurable interrupt output pins, an external reset input, and a polarity inversion register. This extended temperature range variant operates from -40°C to +125°C with a supply voltage from 4.5V to 5.5V. Three hardware address pins allow up to eight devices to share the bus, making it suitable for applications requiring additional I/O, such as industrial controls and keypads.

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Search Keywords: MCP23S17ESP

SPECIFICATIONS

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Supplier:

Microchip Technology

Part No:

MCP23S17-E/SP

Unit of Measure:

Per Each

RoHS:

Yes

HTS:

8542390090

COO:

TH

ECCN:

EAR99

Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

15

Package Type:

TUBE

Interface Speed:

10000 kHz

Interface Type:

SPI

Manual Reset:

Yes

Interrupt Output:

Yes

Family:

MCP23S17

I2C Bus Interface Mode:

N/R

Maximum Operating Supply Voltage:

5.5 V

Dimension:

34.67 x 7.24 x 3.43 mm

This product is not in stock and cannot be back-ordered

This product is discontinued, but still in stock

This product has been discontinued by the supplier

Different packaging options available. See Alternatives

Possible Replacement options available. See Alternatives

This product is NOT RoHS Compliant. See Alternatives

End of Life: Final orders must be placed by

IN STOCK: 1,440

Can Ship immediately

BONDED Quantity: 0

Manufacturer Stock: 0

Stock lot only:

Minimum Order Quantity: 15

MOQ for out of Stock Qty:

Multiple: 15

Factory Lead-Time 6 Weeks

This product is no longer being manufactured but there may be alternatives. We can help you, Contact Us.

Your order may include a combination of full reels and cut tape depending on available stock.

Price (USD)

Qty

Unit Price

15

$1.817

105

$1.383

255

$1.370

510

$1.357

1,005

$1.350

2,505

$1.343

5,010

$1.336

7,500 +

$1.330

Suppliers Standard Package

Standard Packaging

Standard packaging is the minimum package size Masterelectronics.com receives from the supplier. The minimum order quantity might be less than the supplier's standard packaging. The type of packaging (such as reel, tube, tray) may be subject to change when the product is divided into smaller quantities.

Reel Packaging

This product ships on a reel. Depending on the quantity ordered, you may receive full factory reels, cut tape (components on a strip cut from a reel), or a combination of both.

Log in for special pricing Click for Quote Price Match Request

Schedule Order

You may schedule release quantities and ship dates in the shopping cart.

Tools/3D Models

Product Guides

Product Changes

PCN - 25-Nov-2011 - QUALIFICATION OF 8L,14L,16L,20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE

PCN - 08-Nov-2010 - Microchip is announcing the qualification of the listed 28L SPDIP (.300) packages products at GTK as

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES

PCN - 26-Dec-2013 - Microchip is announcing the qualification of palladium coated copper (PdCu) bond wire at MMT (ALPH)

PCN - 06-Feb-2014 - Microchip is announcing the qualification of selected products available in the 28L SPDIP, 8L PDIP,

PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI

PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 25-Nov-2011 - QUALIFICATION OF 8L, 14L, 16L, 20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE

PCN - 08-Nov-2010 - Microchip is announcing the qualification of the CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PD

PCN - 30-Mar-2014 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP PACKAGE WITH PALLADIUM COATED COPPER

PCN - 01-Jul-2022 - DOCUMENT CHANGE

PCN - 18-Dec-2013 - Microchip is announcing the qualification of the listed products in the 28L SPDIP, 8L PDIP, and 18L

PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 08-Oct-2007 - Qualification of GE800 mold compound in assorted PDIP/SPDIP packages at ALPH.

PCN - 02-Nov-2007 - Microchip is qualifying G600 mold compound in PDIP packages at CEI and NSEB.

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES

PCN - 30-Apr-2020 - QUALIFICATION OF G600V AS AN ADDITIONAL/ALTERNATIVE MOLD COMPOUND MATERIAL

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 26-Jan-2011 - Microchip is announcing qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (.300

PCN - 11-Oct-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

PCN - 02-May-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 26-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (

PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb

PCN - 30-Jul-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).

PCN - 12-Nov-2010 - QUALIFICATION OF 28L SPDIP (.300) PACKAGES AT GTK ASSEMBLY SITE.

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

PCN - 07-Jul-2016 - MCP23017/MCP23S17 DATA SHEET DOCUMENT REVISION

PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

PCN - 02-May-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

PCN - 18-Sep-2013 - Microchip is announcing the qualification of the listed products available in the 28L SPDIP, 18L PDI

PCN - 10-Apr-2014 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP PACKAGE WITH PALLADIUM COATED COPPER

PCN - 08-Mar-2007 -

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES

PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 30-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

PCN - 28-Feb-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

PCN - 11-Nov-2004 -

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI

PCN - 30-Mar-2014 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP PACKAGE WITH PALLADIUM COATED COPPER

PCN - 01-Jun-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 01-Jun-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 23-Aug-2013 - Microchip is announcing the qualification of the listed products available in the 28L SPDIP, 8L PDIP

PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 28L SPDIP (.300) packages products at GTK assemb

PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

Product Change Notification

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