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Integrated Circuits - ICs
Linear
Amplifiers - Op Amps, Buffer, Instrumentation
MCP6022-E/P

MCP6022-E/P by microchip technology

MCP6022-E/P

Microchip Technology

Op Amp Dual GP R-R I/O 5.5V Automotive 8-Pin PDIP Tube ...

RoHS Compliant

TUBE Packaging

Accessories

Certificate of Compliance Guarantee

DESCRIPTION

The MCP6022-E/P is a high-performance dual operational amplifier designed for automotive applications, offering a wide range of functionality. This op amp supports rail-to-rail input/output operation and operates on a 5.5V power supply, making it suitable for automotive systems that require precision signal amplification and processing. The compact 8-pin PDIP package allows for easy integration onto circuit boards. With outstanding accuracy, low noise, and excellent stability over temperature, the MCP6022-E/P is an ideal choice for automotive electronics in demanding environments.

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Search Keywords: MCP6022EP

SPECIFICATIONS

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Supplier:

Microchip Technology

Part No:

MCP6022-E/P

RoHS:

Yes

HTS:

8542330001

COO:

TH

ECCN:

EAR99

Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

60

Package Type:

TUBE

Family:

MCP6022

Maximum Input Bias Current:

0.005@5.5V@125C uA

Dimension:

9.27 x 6.35 x 3.3 mm

Maximum Dual Supply Voltage:

N/R

Manufacturer Type:

General Purpose Amplifier

Maximum Input Offset Current:

0.000001(Typ)@5.5V uA

Maximum Input Offset Voltage:

0.25@5V mV

Maximum Operating Supply Voltage:

5.5 V

This product is not in stock and cannot be back-ordered

This product is discontinued, but still in stock

This product is not in stock and cannot be back-ordered

Different packaging options available. See Alternatives

Possible Replacement options available. See Alternatives

This product is NOT RoHS Compliant. See Alternatives

End of Life: Final orders must be placed by

IN STOCK: 1,140

Can Ship immediately

BONDED Quantity: 0

Manufacturer Stock: 2,300 can ship 12/5/25

Minimum Order: 60

Available in less than min:

MOQ for out of Stock Qty:

Multiple: 60

Factory Lead-Time 7 Weeks can ship 1/12/26

This product is no longer being manufactured but there may be alternatives. We can help you, Contact Us.

Price (CAD)

Qty

Unit Price

60

$2.263

300 +

$2.124

Suppliers Standard Package

Standard Packaging

Standard packaging is the minimum package size Masterelectronics.com receives from the supplier. The minimum order quantity might be less than the supplier's standard packaging. The type of packaging (such as reel, tube, tray) may be subject to change when the product is divided into smaller quantities.

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Tools/3D Models

Product Guides

Product Changes

PCN - 08-Oct-2007 - Qualification of GE800 mold compound in assorted PDIP/SPDIP packages at ALPH.

PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 05-Nov-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 01-Jan-2006 - QUALIFICATION OF 8L PDIP PACKAGE AT NEW ASSEMBLY SITE NSE2

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 28-Aug-2008 - Microchip is qualifying the G600C Mold Compound and 8361 J Die attach Epoxy for 8L, 14L, and 16L PDI

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 22-Jan-2004 - Product Change Notice

PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE

PCN - 26-Jan-2011 - Microchip is announcing qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (.300

PCN - 25-Nov-2011 - QUALIFICATION OF 8L,14L,16L,20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 17-Sep-2006 - QUALIFICATION OF 8L TSSOP AT VGT

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES

PCN - 31-Oct-2008 - QUALIFICATION OF G600C MOLD COMPOUND

PCN - 28-Feb-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

PCN - 08-Mar-2007 - Product Change Notice

PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse

PCN - 15-Sep-2008 - Microchip is changing the bill of material by changing the mold compound to G600C and Die Attach Epo

PCN - 01-Jun-2005 - QUALIFICATION OF 8L SOIC PACKAGE IN STRIP MAGAZINE FORM AT HANA

PCN - 02-Nov-2007 - Microchip is qualifying G600 mold compound in PDIP packages at CEI and NSEB.

PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 25-Nov-2011 - QUALIFICATION OF 8L, 14L, 16L, 20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE

PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f

PCN - 26-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (

PCN - 19-May-2008 - ADDING NEW ASSEMBLY SITE

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 08-Oct-2010 - Microchip is announcing the quallification of 8L, 14L, & 16L PDIP at GTK (GRTK) assembly site for th

PCN - 11-Nov-2004 - Product Change Notice

PCN - 01-Mar-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM

PCN - 22-Jan-2004 - QUALIFY UNISEM FOR ASSEMBLY OF 8L PDIP PACKAGES

PCN - 30-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE

PCN - 08-Nov-2010 - Microchip is announcing the qualification of the CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PD

PCN - 19-Apr-2010 - Microchip is announcing the qualification of 8L, 14L, & 16L PDIP at GTK (GRTK) assembly site for the

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 24-Jun-2008 - Microchip is qualifying a new assembly site of 8L PDIP .300" package Linear Devices, Mixed Signal De

PCN - 13-Jun-2005 - NEW LEADFRAME SUPPLIER FOR 8L SOIC .150

PCN - 31-Oct-2008 - QUALIFICATION OF G600C MOLD COMPOUND AND 8361J DIE ATTACH EPOXY AT ANAP ASSEMBLY

ALTERNATIVE PRODUCTS

Alternative Packaging
In Stock: 1920
Minimum Order Quantity: 60

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