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Integrated Circuits - ICs
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Amplifiers - Op Amps, Buffer, Instrumentation
MCP607T-I/SN

ALTERNATIVE PRODUCTS

Alternative Packaging

MCP607-I/SN

In Stock: 0

Minimum Order: 100

MCP607T-I/SN by microchip technology

Image is representational - see manufacturer specifications

Microchip Technology Authorized Distributor

MCP607T-I/SN

2.5V to 6.0V - Micropower CMOS - Dual Op Amp - Industrial Temperature - 8LD SOIC Package ...

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RoHS Compliant

REEL Packaging

Accessories

Certificate of Compliance

DESCRIPTION

The MCP607T-I/SN is a dual operational amplifier unity-gain stable with low offset voltage (250 µV, maximum). Performance characteristics include rail-to-rail output swing capability and low input bias current (80 pA at +85°C, maximum). It works in industrial temp. range -40°C-85°C. Package type is a plastic SOIC (3.90 mm body), 8-lead.

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Potential Applications:

Search Keywords: MCP607TISN

SPECIFICATIONS

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Supplier:

Microchip Technology

Part No:

MCP607T-I/SN

Unit of Measure:

Per Each

RoHS:

Yes

HTS:

8542330001

COO:

TH

ECCN:

EAR99

Reel Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

3300

Package Type:

REEL

Manufacturer Type:

Micropower Amplifier

Maximum Input Offset Current:

0.000001(Typ)@5.5V uA

Family:

MCP607

Maximum Dual Supply Voltage:

N/R

Maximum Operating Supply Voltage:

6 V

Dimension:

4.9 x 3.9 x 1.25(Min) mm

Maximum Input Bias Current:

N/A

Maximum Input Offset Voltage:

0.25@5.5V mV

This product is not in stock and cannot be back-ordered

This product is discontinued, but still in stock

This product is not in stock and cannot be back-ordered

Different packaging options available. See Alternatives

Possible Replacement options available. See Alternatives

This product is NOT RoHS Compliant. See Alternatives

End of Life: Final orders must be placed by

IN STOCK: 3,550

Ships today, if you order in

BONDED Quantity: 0

Manufacturer Stock: 130,900 can ship 8/28/26

Stock lot only:

MOQ for In Stock Qty: 250

MOQ for out of Stock Qty: 825

Multiple: 1

Factory Lead-Time 4 Weeks can ship 9/11/26

This product is no longer being manufactured but there may be alternatives. We can help you, Contact Us.

Your order may include a combination of full reels and cut tape depending on available stock.

Full Reels Only – Selecting this will hold your order for full reel fulfillment. Cut tape will not be substituted.

Price (USD)

A tariff of {0} may be applied if shipping to the United States.

Qty

Unit Price

250

$1.077

500

$1.056

825

$1.045

1,650

$1.035

2,475

$1.025

3,300 +

$1.015

Reel Package

Standard Packaging

Standard packaging is the minimum package size Masterelectronics.com receives from the supplier. The minimum order quantity might be less than the supplier's standard packaging. The type of packaging (such as reel, tube, tray) may be subject to change when the product is divided into smaller quantities.

Reel Packaging

This product ships on a reel. Depending on the quantity ordered, you may receive full factory reels, cut tape (components on a strip cut from a reel), or a combination of both.

Log in for special pricing Click for Quote Price Match Request

Schedule Order

You may schedule release quantities and ship dates in the shopping cart.

Tools/3D Models

Product Guides

Product Changes

PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE

PCN - 11-Nov-2004 - Product Change Notice

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 17-Sep-2006 - QUALIFICATION OF 8L TSSOP AT VGT

PCN - 26-May-2005 - Product Change Notice

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER

PCN - 01-Nov-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND

PCN - 24-Sep-2009 - Microchip Has Released A New Devicedoc For The 2.5V To 6.0V Micropower Cmos Op Amp Of Devices

PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS

PCN - 22-Jan-2004 - Product Change Notice

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 08-Mar-2007 - Product Change Notice

PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

PCN - 24-Sep-2009 - Microchip Has Released A New Device Document For The 2.5V To 6.0V Micropower Cmos Op Amp Of Devices.

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 01-Mar-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM

PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER

PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

Product Change Notification

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