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Integrated Circuits - ICs
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Amplifiers - Op Amps, Buffer, Instrumentation
MCP6282T-E/MS

MCP6282T-E/MS by microchip technology

MCP6282T-E/MS

Microchip Technology

Dual Op Amp - Rail to Rail I/O - 5MHz - 450uA - 2.2 to 6.0V - 8-lead MSOP - -40°C to 125°C - Tape&Reel ...

RoHS Compliant

REEL Packaging

Accessories

Certificate of Compliance Guarantee

DESCRIPTION

The MCP6282T-E/MS is a high-performance dual op amp designed for a wide range of applications. It features rail-to-rail input and output capability, allowing it to operate with signals that span the entire supply voltage range. With a frequency response of up to 5MHz, this op amp is suitable for both audio and precision applications. It operates on a low quiescent current of 450uA, making it ideal for portable and battery-powered devices. The MCP6282T-E/MS comes in an 8-lead MSOP package and can operate within a temperature range of -40Â°C to 125Â°C. It is available in tape and reel packaging for ease of manufacturing and storage.

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Search Keywords: MCP6282TEMS

SPECIFICATIONS

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Supplier:

Microchip Technology

Part No:

MCP6282T-E/MS

RoHS:

Yes

HTS:

8542330001

COO:

TH

ECCN:

EAR99

Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

2500

Package Type:

REEL

Maximum Input Offset Current:

0.000001(Typ)@5.5V uA

Maximum Operating Supply Voltage:

5.5 V

Maximum Input Bias Current:

N/A

Dimension:

3 x 3 x 0.85 mm

Family:

MCP6282

Maximum Input Offset Voltage:

3@5.5V mV

Maximum Dual Supply Voltage:

N/R

Manufacturer Type:

General Purpose Amplifier

This product is not in stock and cannot be back-ordered

This product is discontinued, but still in stock

This product is not in stock and cannot be back-ordered

Different packaging options available. See Alternatives

Possible Replacement options available. See Alternatives

This product is NOT RoHS Compliant. See Alternatives

End of Life: Final orders must be placed by

IN STOCK: 4,850

Can Ship immediately

BONDED Quantity: 0

Manufacturer Stock: 401,107 can ship 12/5/25

Minimum Order: 500

Available in less than min:

MOQ for out of Stock Qty:

Multiple: 1

Factory Lead-Time 4 Weeks can ship 12/22/25

This product is no longer being manufactured but there may be alternatives. We can help you, Contact Us.

Price (CAD)

Qty

Unit Price

500

$1.178

1,000

$1.172

1,500

$1.166

2,000

$1.160

2,500

$1.155

5,000 +

$1.148

Suppliers Standard Package

Standard Packaging

Standard packaging is the minimum package size Masterelectronics.com receives from the supplier. The minimum order quantity might be less than the supplier's standard packaging. The type of packaging (such as reel, tube, tray) may be subject to change when the product is divided into smaller quantities.

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You may schedule release quantities and ship dates in the shopping cart.

Tools/3D Models

Product Guides

Product Changes

PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS

PCN - 30-Jan-2006 - Product Change Notice

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 25-Jun-2010 - Microchip is announcing the qualification of larger paddle in 8L MSOP package with G600F mold compou

PCN - 17-Sep-2006 - QUALIFICATION OF 14L TSSOP AT ATP

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 08-Mar-2007 - Product Change Notice

PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8L MSOP package products with SG-8300GM mold com

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 31-Aug-2008 - QUALIFICATION OF G700K MOLD COMPOUND FOR 8L AND 10L MSOP (3X3 MM) PACKAGES AT ATP ASSEMBLY

PCN - 20-Mar-2009 - QUALIFICATION OF 8L & 10L MSOP WITH 8200T EPOXY AND G600 MOLD COMPOUND AT UTL ASSEMBLY

PCN - 12-Mar-2010 - Microchip is announcing the qualification of larger paddle in 8L MSOP package with G600F mold compou

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 05-Aug-2008 - Microchip is qualifying G700K old compound for 8L and 10L MSOP (3X3 MM) packaged at ATP assembly to

PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8L MSOP package products with SG-8300GM mold com

PCN - 31-Dec-2011 - QUALIFICATION OF 8L MSOP PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 09-Jun-2008 - Microchip is changing the material i.e mold compound from MP8000 to G700K for 8L and 10L MSOP packag

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 01-Feb-2011 - QUALIFICATION OF 8L MSOP PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE

PCN - 11-Nov-2004 - Product Change Notice

PCN - 11-Mar-2009 - Microchip is qualifying the Molding Compound and Epoxy in 8L MSOP & 10L MSOP Package with G600 moldi

PCN - 31-Aug-2008 - QUALIFICATION OF G700K MOLD COMPOUND FOR 8L AND 10L MSOP (3X3 MM) PACKAGES AT ATP ASSEMBLY

PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 20-May-2010 - QUALIFICATION OF LARGER PADDLE IN 8L MSOP PACKAGE WITH G600F MOLD COMPOUND AT MMS (ATES) ASSEMBLY

PCN - 30-Jul-2010 - QUALIFICATION OF LARGER PADDLE IN 8L MSOP PACKAGE WITH G600F MOLD COMPOUND AT MMS (ATES) ASSEMBLY

ALTERNATIVE PRODUCTS

Alternative Packaging
In Stock: 2000
Minimum Order Quantity: 100

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