ATS-52230B-C1-R0
Advanced Thermal Solutions, Inc23.0 x 23.0 x 7.5 mm BGA Heat Sink - High Performance maxiFLOW/maxiGRIP-STD with Heat Sink Clip Anodized Aluminum ...
DESCRIPTION
The ATS-52230B-C1-R0 is a high-performance BGA heat sink designed for efficient thermal management in electronic devices. With a compact size of 23.0 x 23.0 x 7.5 mm, this heat sink is the perfect choice for space-constrained applications. It features the innovative maxiFLOW/maxiGRIP-STD design, which improves heat dissipation by maximizing airflow and increasing the surface area for heat transfer.Made from anodized aluminum, this heat sink offers excellent corrosion resistance and durability. It comes with a heat sink clip for secure and easy installation. Whether in consumer electronics, telecommunications, or industrial equipment, the ATS-52230B-C1-R0 is an ideal solution for keeping your components cool and maximizing their performance.
Search Keywords: ATS52230BC1R0
SPECIFICATIONS
IN STOCK: 50
Can Ship immediately
Minimum Order: 5
Factory Lead-Time 8 Weeks
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