DILB18P-223TLF
Amphenol Communications Solutions (FCI)DIP Socket - 18 (2 x 9) Position - 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Pitch - Open Frame - Solder Termination - Through Hole. ...
DESCRIPTION
The DILB18P-223TLF from Amphenol Communications Solutions is through hole mounting DIP socket with 18 (2 x 9) position, 0.3" (7.62mm) row spacing, 0.100" (2.54mm) pitch and solder termination. This open frame socket has copper alloy contacts with 100.0µin (2.54µm) tin-lead finish and polyamide (PA), nylon housing. Operating temperature range is from -55°C to 125°C.
Search Keywords: DILB18P223TLF
SPECIFICATIONS
IN STOCK: 44,980
Can Ship immediately
Minimum Order: 400
Factory Lead-Time 9 Weeks
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