APF19-19-06CB/A01
CTS CorporationThe APF19-19-06CB/A01 is a low-profile, forged aluminum heat sink with plate fins, designed for adhesive mounting on surface mount packages. ...
DESCRIPTION
The APF19-19-06CB/A01 is a low-profile forged heat sink for thermal management of BGA and other surface mount components. Constructed from black anodized 6063 aluminum alloy, it measures 19 x 19 x 6.3 mm. It features a thermal resistance of 18.4 °C/W under natural convection, which improves to 8.4 °C/W with forced airflow of 200 LFPM. This model comes with a pre-applied A01 double-sided acrylic adhesive on a Kapton® MT carrier for secure attachment. Its precision-forged design is ideal for high-power applications requiring efficient, passive, or active cooling without the need for special tools or PCB modifications.
Search Keywords: APF191906CBA01
SPECIFICATIONS
IN STOCK: 1,673
Can Ship immediately
MOQ for In Stock Qty: 5
MOQ for out of Stock Qty: 630
Factory Lead-Time 10 Weeks
English
French
