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BDN13-3CB/A01 by cts corporation

BDN13-3CB/A01

CTS Corporation

Heat Sink Passive Pin Array Adhesive 16.1°C/W Black Anodized ...

Datasheet
RoHS Compliant
Tray Packaging
Accessories
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DESCRIPTION

The CTS CORP part BDN13-3CB/A01 is a heat sink designed for efficient heat dissipation in electronic devices. Featuring a passive pin array design and an adhesive backing, this heat sink offers excellent thermal conductivity with a thermal resistance of 16.1°C/W. Its black anodized finish provides enhanced durability and a sleek, professional look. Perfect for applications where heat management is crucial, the CTS CORP heat sink is a reliable choice to ensure optimal performance and longevity of your electronic components.

Search Keywords: BDN133CBA01

SPECIFICATIONS

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Supplier:
CTS Corporation
Part No:
BDN13-3CB/A01
RoHS:
Yes
HTS:
8473305100
COO:
CN
ECCN:
EAR99
Supplier Standard Pack:  This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1320
Package Type:
Tray
Device Cooled:
N/A
Attachment Method:
Adhesive Tape
Dimension:
33.274 x 33.274 x 9.017 mm
Thermal Resistance:
16.1 °C/W
Finish:
Black Anodized

IN STOCK: 3,088

Ships today, if you order in

Minimum Order: 10

Factory Lead-Time 10 Weeks

Price (USD)

Qty
Unit Price
10
$2.544
50
$2.431
250
$2.318
500
$2.266
1,320
$2.204
2,640
$2.153
5,280 +
$1.514
Suppliers Standard Package
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