4900P-250G

PasteClean Jar Sn96.8Ag3.2Cu0.6 ...

RoHS Compliant

DESCRIPTION

4900P SAC305 Solder Paste is a no-clean solder paste made from a blend of high-purity, non-recycled tin, silver and copper metal powder mixed with a no-clean flux. This halogen-free and lead-free solder paste is designed for extreme flux activity and the enhanced printing requirements of ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.4900P is the best lead-free solder paste for facilitating high speed printing. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3 mm.We also offer a no-clean Sn63/Pb37 solder paste and a no-clean low temperature solder paste.

Product Highlights:

Potential Applications:

Search Keywords: 4900P250G

SPECIFICATIONS

Product Attribute

Attribute Value

Select Attribute

Products found: 0

Supplier:

M.G. Chemical Canada

Part No:

4900P-250G

RoHS:

Yes

HTS:

8311303000

COO:

ECCN:

EAR99

Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

Form:

Paste12874

Alloy Composition:

Sn96.8Ag3.2Cu0.612871

Wire Diameter:

N/R

Flux Type:

No Clean12873

Melting Temperature:

N/A

Family:

4900P

IN STOCK: 4

Can Ship immediately

BONDED Quantity: 0

Manufacturer Stock: 0

Available in less than min:

MOQ for out of Stock Qty:

Multiple: 1

Factory Lead-Time 9 Weeks

This product is no longer being manufactured but there may be alternatives. We can help you, Contact Us.

Price (CAD)

Qty

Unit Price

$163.815

$152.886

5 +

$148.924

Click for Quote

Tools/3D Models

Product Guides

Datasheet