DESCRIPTION
861 is a CPU heat sink compound. Our thermal paste designed to reduce thermal resistance between irregular metal surfaces. Coupled with reasonable thermal conductivity, 860 has a soft consistency and a wide operating temperature range, which in some instances makes it the best thermal paste for CPUapplications.This silicone-based PC thermal paste is mostly used to improve heat flow between heat sinks and heat-generating components, such as CPUs, GPUs, LEDs, motors, and power components.For a silicone-free thermal paste, try 8616.We also offer electrically conductive greases, dielectric greases, and lubricating greases.
Search Keywords: 8604G
SPECIFICATIONS
IN STOCK: 6
Can Ship immediately
Price Per: Package
Factory Lead-Time 2 Weeks
Price (CAD)
Product Guides
English
French
