820-AG11D-LF
TE Connectivity / Buchanan BrandConn DIP Socket SKT 20 POS 2.54mm Solder ST Thru-Hole Tube ...
DESCRIPTION
The 820-AG11D-LF is a 20-position DIP socket designed for vertical thru-hole mounting on printed circuit boards. It features a standard profile with a ladder frame style, beryllium copper contacts with gold plating in the mating area, and screw machine contact style with four-fingered mating configuration. The socket has a row-to-row spacing of 7.62 mm, centerline spacing of 2.54 mm, and a height above the PCB of 2.67 mm, with solder tail contacts plated in tin and a post length of 3.18 mm. Electrical performance includes an insulation resistance of 5,000 MO and contact resistance of 10 mO, with operation across a temperature range of -55°C to +105°C. The housing is constructed from thermoplastic polyester with UL 94V-0 flammability rating and is RoHS/ELV compliant, making it suitable for industrial and commercial applications requiring reliable IC socket connections.
Product Highlights:
- DIP Socket
- Number of Positions = 20
- Row-to-Row Spacing = 7.62 mm
- Thru Hole
- Mount Style = Vertical
Search Keywords: 820AG11DLF
SPECIFICATIONS
IN STOCK: 750
Ships today, if you order in
Minimum Order Quantity: 24
Multiple: 24
Price (USD)
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