HTS191-P by te connectivity / chip coolers brand
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TE Connectivity / Chip Coolers Brand Authorized Distributor

HTS191-P

Heat Sink Passive BGA Radial Clip Aluminum Black Anodized ...

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RoHS Compliant
Tray Packaging
Accessories
Discontinued
Certificate of Compliance

DESCRIPTION

HTS191-P is a heat sink assembly designed for thermal management of BGA semiconductor packages. This 25mm heat sink features a 2 fin radial design constructed from aluminum with a black anodize finish for enhanced heat dissipation. The product is EU RoHS/ELV compliant, ensuring environmental compliance for electronic applications. It is commonly used in applications requiring efficient cooling of BGA devices, providing reliable thermal performance in electronic systems.

Product Highlights:

  • Heat Sink
  • BGA
  • Package Size = 25 [.985] mm [in]
  • For Use With BGA Semiconductor Packages
  • Diameter = 25.00 mm

Search Keywords: HTS191P

SPECIFICATIONS

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Products found: 0
Supplier:
TE Connectivity / Chip Coolers Brand
Part No:
HTS191-P
Alias/AKA:
5-1542000-6
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8542900000
COO:
US
ECCN:
EAR99
Supplier's Standard Package: The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution.
1
Package Type:
Tray
Life Cycle:
Discontinued
  This product is discontinued, but still in stock

IN STOCK: 232

Ships today, if you order in

Minimum Order Quantity: 6

Price (USD)

Qty
Unit Price
6
$20.48
27
$19.51
110
$18.61
270
$17.81
790 +
$17.06
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