HTS285NF-D by te connectivity / chip coolers brand
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TE Connectivity / Chip Coolers Brand Authorized Distributor

HTS285NF-D

Heat Sink Passive BGA Pin Array Cold-Forged Aluminum Black Anodized ...

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RoHS Compliant
Box Packaging
Accessories
Discontinued
Certificate of Compliance

DESCRIPTION

HTS285NF-D is a BGA heat sink assembly designed for thermal management of BGA semiconductor packages. The unit features a cold-forged aluminum construction with a 50.80 mm diameter and 19.05 mm height, providing efficient heat dissipation in compact form factors. It includes a four-leg standard mounting clip (Part Number 1542026-1) that does not increase the overall heat sink height, enabling seamless integration into space-constrained applications. The assembly is RoHS and ELV compliant with a UL 94V-0 flammability rating, ensuring compliance with environmental and safety standards. This heat sink is ideal for high-performance computing, telecommunications, and industrial applications where reliable thermal management of BGA packages is critical.

Search Keywords: HTS285NFD

SPECIFICATIONS

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Products found: 0
Supplier:
TE Connectivity / Chip Coolers Brand
Part No:
HTS285NF-D
Alias/AKA:
5-1542001-3
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8542900000
COO:
US
ECCN:
EAR99
Supplier's Standard Package: The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution.
1
Package Type:
Box
Life Cycle:
Discontinued
  This product is discontinued, but still in stock

IN STOCK: 40

Ships today, if you order in

Minimum Order Quantity: 4

Price (USD)

Qty
Unit Price
4
$20.72
18
$20.33
35
$19.96
69
$19.57
180
$19.18
500 +
$13.42
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