HTS654-U by te connectivity / chip coolers brand
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TE Connectivity / Chip Coolers Brand Authorized Distributor

HTS654-U

Heat Sink Passive BGA Radial Aluminum Black Anodized ...

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RoHS Compliant
Tray Packaging
Accessories
Discontinued
Certificate of Compliance

DESCRIPTION

The HTS654-U is a heat sink assembly engineered for thermal management of BGA semiconductor packages. It features a 7-fin radial design constructed from aluminum with a black anodize finish, providing effective heat dissipation across a range of operating conditions. The assembly has a package size of 21 mm, a diameter of 34.92 mm, and a height of 22.70 mm, with a flammability rating of UL 94V-0. Thermal resistance varies from 10.56°C/W at 0 LFM to 2.06°C/W at 600 LFM depending on power dissipation levels (5W to 15W), making it suitable for applications requiring efficient passive cooling in compact form factors. The integrated two-leg mounting clip simplifies installation without increasing overall heat sink height, and the product is RoHS and ELV compliant.

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SPECIFICATIONS

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Products found: 0
Supplier:
TE Connectivity / Chip Coolers Brand
Part No:
HTS654-U
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8542900000
COO:
US
ECCN:
EAR99
Supplier's Standard Package: The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution.
1
Package Type:
Tray
Device Cooled:
BGA6707
Attachment Method:
Clip6706
Dimension:
22.7 x 34.926714mm
Thermal Resistance:
N/A
Finish:
Black Anodized6710
Life Cycle:
Discontinued
  This product is discontinued, but still in stock

IN STOCK: 130

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Minimum Order Quantity: 3

Price (USD)

Qty
Unit Price
3
$22.52
15
$22.10
30
$21.69
60
$21.26
450
$20.86
500 +
$14.60
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