HTS828-U

TE Connectivity / Chip Coolers Brand

Heat Sink Assemblies ...

Datasheet

RoHS Compliant

Tray Packaging

Discontinued

DESCRIPTION

Heat Sink Assemblies

Product Highlights:

Heat Sink
BGA
Package Size = 29 [1.142] mm [in]
For Use With BGA Semiconductor Packages
Power Air Velocity Thermal Resistance

Potential Applications:

Search Keywords: HTS828U

SPECIFICATIONS

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Products found: 0

Supplier:

TE Connectivity / Chip Coolers Brand

Part No:

HTS828-U

RoHS:

Yes

HTS:

8542900000

COO:

ECCN:

EAR99

Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

Package Type:

Tray

Life Cycle:

Discontinued

This product is discontinued, but still in stock

IN STOCK: 48

Ships today, if you order in

BONDED Quantity: 0

Manufacturer Stock: 0

Minimum Order: 3

Available in less than min:

MOQ for out of Stock Qty:

Multiple: 1

This product is no longer being manufactured but there may be alternatives. We can help you, Contact Us.

Price (CAD)

Qty

Unit Price

$35.832

$35.159

$34.500

$33.827

225

$33.168

500 +

$23.215

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