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624-25ABT3 by wakefield
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Wakefield Authorized Distributor

624-25ABT3

The 624-25ABT3 is an omnidirectional aluminum pin fin heat sink with a pre-applied thermal adhesive, designed for cooling 21mm BGA packages. ...

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RoHS Compliant
Packaging
Accessories
Certificate of Compliance

DESCRIPTION

The 624-25ABT3 is an omnidirectional pin fin heat sink designed for thermal management of 21mm BGA packages in both natural and forced-convection environments. It is constructed from black anodized aluminum with base dimensions of 0.827 inches square and a fin height of 0.250 inches. This part includes a pre-applied Chomerics T412 (-T3) pressure-sensitive adhesive, which provides a thermal impedance of 0.25 C-in^2/W and is ideal for metal or ceramic surfaces. The integrated adhesive allows for quick and easy mounting, providing a reliable thermal link to the electronic package.

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SPECIFICATIONS

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Products found: 0
Supplier:
Wakefield
Part No:
624-25ABT3
Alias/AKA:
62425ABT3
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
7616995090
COO:
CN
ECCN:
EAR99
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
2500
Device Cooled:
BGA
Attachment Method:
Adhesive
Dimension:
21 x 21 x 6.4 mm
Thermal Resistance:
N/A
Finish:
Black Anodized

IN STOCK: 1,705

Can Ship immediately

Minimum Order Quantity: 25

Factory Lead-Time 16 Weeks

Price (USD)

Qty
Unit Price
25
$3.49
100
$2.31
250
$2.05
500
$1.94
1,000
$1.82
2,500
$1.80
5,000
$1.79
7,500 +
$1.78
Supplier's Standard Package
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