625-25AB by wakefield
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Wakefield Authorized Distributor

625-25AB

Heat Sink - Top Mount - BGA - Thermal Tape, Adhesive (Included) - 0.984" (25.00mm) Square - 6.35mm Pin Fins - 12.00°C/W @ 500 LFM - Aluminum. ...

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RoHS Compliant
Packaging
Accessories
Certificate of Compliance

DESCRIPTION

The WAKEFIELD part 625-25AB is a high-quality heat sink designed specifically for passive BGA pin array applications. It features a durable adhesive that ensures secure attachment to the BGA pin array, while its aluminum construction provides excellent heat dissipation properties. The heat sink is finished with a sleek black anodized coating, adding a touch of elegance to any electronics application. With its reliable performance and attractive design, the WAKEFIELD 625-25AB is the perfect choice for effectively managing heat in BGA pin array setups.

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SPECIFICATIONS

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Products found: 0
Supplier:
Wakefield
Part No:
625-25AB
Alias/AKA:
62525AB
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
7616995090
COO:
CN
ECCN:
EAR99
Supplier's Standard Package: The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution.
1600
Device Cooled:
BGA
Attachment Method:
Adhesive
Dimension:
25 x 25 x 6.4 mm
Thermal Resistance:
N/A
Finish:
Black Anodized

IN STOCK: 1,126

Can Ship immediately

Minimum Order Quantity: 5

Factory Lead-Time 16 Weeks

Price (USD)

Qty
Unit Price
5
$4.04
50
$3.78
100
$3.71
250
$3.61
500
$3.52
1,600 +
$3.40
Supplier's Standard Package
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