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662-15AG by wakefield

662-15AG

Wakefield

Heat Sink Passive BGA Pin Array Adhesive Gold Iridite ...

Datasheet
RoHS Compliant
Packaging
Accessories
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DESCRIPTION

The WAKEFIELD part 662-15AG is a highly efficient and innovative passive heat sink designed specifically for BGA pin arrays. With its adhesive gold iridite coating, this heat sink offers superior thermal management and optimized heat dissipation for BGA components. The compact design ensures easy installation and helps maintain optimal temperature levels, preventing overheating and prolonging the lifespan of your electronic devices. Upgrade your cooling system with the WAKEFIELD 662-15AG and experience enhanced performance and reliability.

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SPECIFICATIONS

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Products found: 0
Supplier:
Wakefield
Part No:
662-15AG
RoHS:
Yes
HTS:
7616995090
COO:
CN
ECCN:
EAR99
Supplier Standard Pack:  This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
720
Device Cooled:
BGA
Attachment Method:
Adhesive
Dimension:
43.5 x 43.5 x 3.8 mm
Thermal Resistance:
N/A
Finish:
Gold Iridite

IN STOCK: 969

Can Ship immediately

MOQ for In Stock Qty: 5

MOQ for out of Stock Qty: 360

Factory Lead-Time 16 Weeks

Price (CAD)

Qty
Unit Price
5
$8.564
100
$5.653
250
$5.476
360
$5.249
720
$5.197
1,080
$5.146
1,440 +
$5.095
Suppliers Standard Package
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Please Note: Tariffs may apply for U.S. shipments

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