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667-10ABSPE by wakefield
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667-10ABSPE

Wakefield

The 667-10ABSPE is a board-level, vertical mount aluminum heat sink with standoff pins designed for cooling TO-220 packages. ...

Datasheet
RoHS Compliant
Packaging
Accessories
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DESCRIPTION

The 667-10ABSPE is a labor-saving, vertical mount heat sink from the 667 series, intended for cooling TO-220 style semiconductor packages. Standing 1.000 inch (25.4 mm) above the PC board, it features wave-solderable hex-shaped standoff pins for secure assembly. Constructed from black anodized aluminum, it achieves a thermal performance of 76°C temperature rise at 6W in natural convection and a thermal resistance of 5.8°C/W with 200 LFM forced air convection. This heat sink is designed for use with SpeedClips to reduce assembly time, offering an effective thermal solution for board-level applications with limited space.

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SPECIFICATIONS

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Products found: 0
Supplier:
Wakefield
Part No:
667-10ABSPE
Alias/AKA:
66710ABSPE
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
7616995090
COO:
CN
ECCN:
EAR99
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
700
Device Cooled:
TO-220
Attachment Method:
Solderable Wave
Dimension:
34.9 x 12.7 x 25.4 mm
Thermal Resistance:
5.8@200LFM °C/W
Finish:
Black Anodized

IN STOCK: 1,000

Ships today, if you order in

MOQ for In Stock Qty: 25

MOQ for out of Stock Qty: 350

Factory Lead-Time 16 Weeks

Price (USD)

Qty
Unit Price
25
$3.21
100
$2.13
250
$1.93
350
$1.84
700
$1.69
1,050
$1.68
1,400 +
$1.66
Suppliers Standard Package
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