D10850-40

Wakefield

Heat Sink Passive BGA Pin Array Adhesive

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RoHS Compliant

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DESCRIPTION

Heat Sink Passive BGA Pin Array Adhesive

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SPECIFICATIONS

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Products found: 0

Supplier:

Wakefield

Part No:

D10850-40

RoHS:

Yes

HTS:

8473309100

COO:

ECCN:

EAR99

Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

Device Cooled:

BGA

Attachment Method:

Adhesive

Dimension:

21.6 x 21.6 x 10.2 mm

Thermal Resistance:

N/A

Finish:

N/A

IN STOCK: 0

BONDED Quantity: 0

Manufacturer Stock: 0

Available in less than min:

MOQ for out of Stock Qty: 257

Multiple: 1

Factory Lead-Time 12 Weeks

This product is no longer being manufactured but there may be alternatives. We can help you, Contact Us.

Price (CAD)

Qty

Unit Price

257

$7.636

513

$4.711

770

$3.726

1,026 +

$3.648

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