828-AG11D-LF
TE Connectivity / Buchanan BrandConn DIP Socket SKT 28 POS 2.54mm Solder ST Thru-Hole Tube ...
DESCRIPTION
828-AG11D-LF is a 28-position DIP socket designed for through-hole mounting of integrated circuits. It features a standard profile open frame ladder design with beryllium copper contacts and gold-plated mating areas for reliable electrical connections. The socket offers a row-to-row spacing of 15.24 mm (0.600 in) with a 2.54 mm (0.100 in) centerline pitch and stands 2.67 mm (0.105 in) above the PC board. With an operating temperature range of -55°C to +105°C and UL 94V-0 flammability rating, it is suitable for demanding electronic applications. The RoHS/ELV compliant design supports wave solder processes up to 265°C, making it ideal for standard PCB assembly operations.
Product Highlights:
- Socket Style = Standard
- Through Hole Contact Termination Type
- 2.54 mm Centerline
- Row-to-Row Spacing = 15.24 mm
- 28 Positions
Search Keywords: 828AG11DLF
SPECIFICATIONS
IN STOCK: 3
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You may purchase all in-stock quantity of 3
Stock lot only: 3
Minimum Order Quantity: 20
Price (USD)
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