HTS248-U by te connectivity / chip coolers brand
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TE Connectivity / Chip Coolers Brand Authorized Distributor

HTS248-U

Heat Sink Passive BGA Radial Clip Aluminum Black Anodized ...

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RoHS Compliant
Box Packaging
Accessories
Discontinued
Certificate of Compliance

DESCRIPTION

HTS248-U is a heat sink assembly designed for thermal management of BGA semiconductor packages. It features a radial fin style with 4 fins, constructed from aluminum with a black anodized plating for enhanced heat dissipation. The heat sink has a diameter of 34.92 mm (1.375 in) and a height of 13.87 mm (0.546 in), supporting power dissipation ratings of 5W, 10W, and 15W. Thermal resistance values range from 2.9°C/W to 10.98°C/W depending on operating conditions. This heat sink is EU RoHS and ELV compliant with exemptions and carries a UL 94V-0 flammability rating, making it suitable for applications requiring reliable thermal solutions for BGA devices.

Product Highlights:

  • Heat Sink
  • BGA
  • Package Size = 35 [1.379] mm [in]
  • For Use With BGA Semiconductor Packages
  • Power Air Velocity Thermal Resistance

Search Keywords: HTS248U

SPECIFICATIONS

Product Attribute
Attribute Value
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Products found: 0
Supplier:
TE Connectivity / Chip Coolers Brand
Part No:
HTS248-U
Alias/AKA:
9-1542000-4
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8542900000
COO:
US
ECCN:
EAR99
Supplier's Standard Package: The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution.
1
Package Type:
Box
Device Cooled:
BGA6707
Attachment Method:
Clip6706
Dimension:
13.87 x 34.926714mm
Thermal Resistance:
N/A
Finish:
Black Anodized6710
Life Cycle:
Discontinued
  This product is discontinued, but still in stock

IN STOCK: 250

Ships today, if you order in

Minimum Order Quantity: 3

Price (USD)

Qty
Unit Price
3
$24.53
15
$24.08
30
$23.62
59
$23.16
250
$22.70
500 +
$15.89
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