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625-25AB by wakefield

625-25AB

Wakefield

Heat Sink - Top Mount - BGA - Thermal Tape, Adhesive (Included) - 0.984" (25.00mm) Square - 6.35mm Pin Fins - 12.00°C/W @ 500 LFM - Aluminum. ...

Datasheet
RoHS Compliant
Packaging
Accessories
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DESCRIPTION

The WAKEFIELD part 625-25AB is a high-quality heat sink designed specifically for passive BGA pin array applications. It features a durable adhesive that ensures secure attachment to the BGA pin array, while its aluminum construction provides excellent heat dissipation properties. The heat sink is finished with a sleek black anodized coating, adding a touch of elegance to any electronics application. With its reliable performance and attractive design, the WAKEFIELD 625-25AB is the perfect choice for effectively managing heat in BGA pin array setups.

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SPECIFICATIONS

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Supplier:
Wakefield
Part No:
625-25AB
RoHS:
Yes
HTS:
7616995090
COO:
CN
ECCN:
EAR99
Supplier Standard Pack:  This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1600
Device Cooled:
BGA
Attachment Method:
Adhesive
Dimension:
25 x 25 x 6.4 mm
Thermal Resistance:
N/A
Finish:
Black Anodized

IN STOCK: 1,126

Ships today, if you order in

MOQ for In Stock Qty: 10

MOQ for out of Stock Qty: 400

Factory Lead-Time 16 Weeks

Price (CAD)

Qty
Unit Price
10
$4.961
100
$4.885
250
$4.808
400
$4.732
800
$2.909
1,200
$2.312
1,600 +
$2.266
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