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630-60AB by wakefield

630-60AB

Wakefield

Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized ...

Datasheet
RoHS Compliant
Packaging
Accessories
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DESCRIPTION

The WAKEFIELD part 630-60AB, a Heat Sink Passive BGA Pin Array especially designed for optimal heat dissipation. This heat sink is constructed from durable and lightweight adhesive aluminum, ensuring superior cooling performance. With its sleek black anodized finish, this heat sink not only adds a stylish touch to your electronic devices but also provides effective thermal management. Equipped with a BGA pin array, it offers effortless installation and compatibility with various BGA packages. Improve the longevity and performance of your electronics with the WAKEFIELD part 630-60AB Heat Sink Passive BGA Pin Array.

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SPECIFICATIONS

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Products found: 0
Supplier:
Wakefield
Part No:
630-60AB
RoHS:
Yes
HTS:
7616995090
COO:
CN
ECCN:
EAR99
Supplier Standard Pack:  This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
400
Device Cooled:
BGA
Attachment Method:
Adhesive
Dimension:
35 x 35 x 15.2 mm
Thermal Resistance:
N/A
Finish:
Black Anodized

IN STOCK: 1,711

Ships today, if you order in

Minimum Order: 25

Factory Lead-Time 16 Weeks

Price (CAD)

Qty
Unit Price
25
$1.949
100
$1.774
400
$1.704
800
$1.668
1,200
$1.635
2,800
$1.460
5,200
$1.438
7,600 +
$1.415
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