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642-25AB by wakefield

642-25AB

Wakefield

Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized ...

Datasheet
RoHS Compliant
Packaging
Accessories
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DESCRIPTION

The WAKEFIELD part 642-25AB is a high-quality heat sink designed for optimal cooling performance. With its passive BGA pin array design, it efficiently dissipates heat from electronic components, ensuring their longevity and reliability. The heat sink is made from adhesive aluminum with a sleek black anodized finish, providing excellent thermal conductivity and a visually appealing aesthetic. Ideal for a wide range of applications, this heat sink is a reliable choice for keeping your electronic systems running cool and efficient.

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SPECIFICATIONS

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Products found: 0
Supplier:
Wakefield
Part No:
642-25AB
RoHS:
Yes
HTS:
7616995090
COO:
CN
ECCN:
EAR99
Supplier Standard Pack:  This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
800
Device Cooled:
BGA
Attachment Method:
Adhesive
Dimension:
35 x 35 x 6.4 mm
Thermal Resistance:
N/A
Finish:
Black Anodized
  Possible Replacement options available.  See Alternatives

IN STOCK: 29

Can Ship immediately

Minimum Order: 25

Factory Lead-Time 16 Weeks

Price (CAD)

Qty
Unit Price
25
$2.832
250
$1.862
800
$1.801
1,600
$1.740
3,200
$1.725
5,600
$1.708
8,000 +
$1.693
Suppliers Standard Package
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