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658-25AB by wakefield

658-25AB

Wakefield

Heat Sink Passive BGA Pin Array Adhesive Black Anodized ...

Datasheet
RoHS Compliant
Packaging
Accessories
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DESCRIPTION

The WAKEFIELD part 658-25AB is a passive BGA pin array heat sink designed for effective heat dissipation in electronic devices. With a black anodized finish and adhesive backing, this heat sink offers reliable thermal management while seamlessly integrating into your assembly. Perfect for applications where space is limited and cooling is crucial, the WAKEFIELD 658-25AB ensures optimal performance and longevity for your electronic components.

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SPECIFICATIONS

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Products found: 0
Supplier:
Wakefield
Part No:
658-25AB
RoHS:
Yes
HTS:
7616995090
COO:
CN
ECCN:
EAR99
Supplier Standard Pack:  This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1200
Device Cooled:
BGA
Attachment Method:
Adhesive
Dimension:
27.9 x 27.9 x 6.4 mm
Thermal Resistance:
N/A
Finish:
Black Anodized

IN STOCK: 1,001

Ships today, if you order in

Minimum Order: 25

Factory Lead-Time 16 Weeks

Price (CAD)

Qty
Unit Price
25
$1.488
250
$1.332
500
$1.302
1,200
$1.274
3,600
$1.090
6,000
$1.073
8,400
$1.059
10,800 +
$0.914
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