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658-45ABT4E by wakefield

658-45ABT4E

Wakefield

Heat Sink Passive BGA Pin Array Adhesive Black Anodized ...

Datasheet
RoHS Compliant
Packaging
Accessories
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DESCRIPTION

The WAKEFIELD part 658-45ABT4E is a high-performance heat sink designed to dissipate heat from a passive BGA pin array. It features a black anodized finish for enhanced thermal conductivity and durability. With its adhesive backing, installation is quick and easy, ensuring efficient heat transfer and temperature regulation. Upgrade your system's cooling capabilities with this reliable and efficient heat sink solution.

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SPECIFICATIONS

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Products found: 0
Supplier:
Wakefield
Part No:
658-45ABT4E
RoHS:
Yes
HTS:
7616995090
COO:
CN
ECCN:
EAR99
Supplier Standard Pack:  This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1000
Device Cooled:
BGA
Attachment Method:
Adhesive
Dimension:
27.9 x 27.9 x 11.4 mm
Thermal Resistance:
N/A
Finish:
Black Anodized

IN STOCK: 0

MOQ for out of Stock Qty: 250

Factory Lead-Time 16 Weeks

Price (CAD)

Qty
Unit Price
250
$5.327
500
$3.279
750
$2.586
1,000 +
$2.541
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