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658-60AB by wakefield

658-60AB

Wakefield

Heat Sink Passive BGA Pin Array Adhesive Black Anodized

Datasheet
RoHS Compliant
Packaging
Accessories
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DESCRIPTION

Heat Sink Passive BGA Pin Array Adhesive Black Anodized

Search Keywords: 65860AB

SPECIFICATIONS

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Products found: 0
Supplier:
Wakefield
Part No:
658-60AB
RoHS:
Yes
HTS:
7616995090
COO:
CN
ECCN:
EAR99
Supplier Standard Pack:  This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
700
Device Cooled:
BGA
Attachment Method:
Adhesive
Dimension:
27.9 x 27.9 x 15.2 mm
Thermal Resistance:
N/A
Finish:
Black Anodized

IN STOCK: 1,338

Ships today, if you order in

Minimum Order: 25

Factory Lead-Time 16 Weeks

Price (CAD)

Qty
Unit Price
25
$2.159
250
$1.838
700
$1.745
1,400
$1.731
2,800
$1.638
5,600 +
$1.546
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