125800D00000G by boyd laconia llc
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Boyd Laconia LLC Authorized Distributor

125800D00000G

Heat Sink Passive BGA Anchor ...

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RoHS Compliant
Bulk Packaging
Accessories
Certificate of Compliance

DESCRIPTION

125800D00000G is a BGA solder anchor designed for securing heat sink clips to printed circuit boards. This solder anchor is specifically engineered for PCB thicknesses of 0.100 to 0.110 inches and features an "A" dimension of 4.70 mm (0.185 inches). The product is RoHS compliant and requires 2 to 4 solder anchors to be soldered to the PCB prior to attaching the heat sink clip. Key dimensional specifications include a height of 7.19 mm (0.283 inches), a base width of 7.62 mm (0.300 inches), and a stem diameter of 0.64 mm (0.025 inches). This solder anchor is ideal for thermal management applications where reliable mechanical attachment of heat sinks to BGA packages is required.

Search Keywords: 125800D00000G

SPECIFICATIONS

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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
125800D00000G
Alias/AKA:
043409
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8542900000
COO:
CN
ECCN:
EAR99
Supplier's Standard Package: The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution.
50000
Package Type:
Bulk
Type:
Passive
Material:
N/A
Family:
125800D00000
Dimension:
7.62 x 2.49 x 7.19mm

IN STOCK: 4,600

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Minimum Order Quantity: 100

Factory Lead-Time 6 Weeks

Price (USD)

Qty
Unit Price
100
$0.4952
1,000
$0.3489
2,500
$0.3378
5,000
$0.3239
7,500
$0.3207
25,000
$0.3175
50,000
$0.3145
100,000 +
$0.2917
Supplier's Standard Package
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