Boyd Laconia LLC

Boyd Corporation is a world-leading innovator of technologies in material science, engineered materials, and thermal management that seal, protect, interface with, and cool our customers’ most critical applications. Our solutions maximize performance in 5G infrastructure and the world’s most advanced data centers; enhance reliability and extend range for electric and autonomous vehicles; advance the accuracy of cutting-edge personal healthcare and diagnostic systems, enable performance critical aircraft and defense technologies; and accelerate innovation in next-generation electronics and human-machine-interface.

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Introduction to the Main Types of Thermosiphons

How to Cool and Protect Battery Energy Storage Systems (BESSs)

What is Two Phase Enhanced Air Cooling?

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Resources

Heat Pipe Calculator

Heat Exchanger Selector Tool

Cold Plate Selector Tool

Cooling System Selector Tool

Thermal Software Solutions

[Whitepaper] Engineer’s Guide to Hyperscale Network Material Applications

[Whitepaper] 7 Most Common Myths About Heat Pipes

[Whitepaper] Two Phase Thermal Solution Guide

BOYD Board Level Heat Sinks

BOYD offers thousands of heat sink options for cooling semiconductor packages and other devices for use on printed circuit boards (PCBs). Available in a variety of shapes, sizes, profiles, fabrications, and mountings, Aavid offers the widest selection of board-level cooling solutions.

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NEWS

Boyd News

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Boyd Laconia LLC

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