504102B00000G
Boyd Laconia LLCA board-level, narrow channel heat sink made of black anodized aluminum, designed to cool TO-220 devices. ...
DESCRIPTION
The 504102B00000G is a board-level heat sink from the Channel 5040 series, designed for the thermal management of TO-220 devices. Constructed from aluminum with a black anodize finish, this component has dimensions of 19.80 mm in width, 21.59 mm in length, and 17.80 mm in height. The heat sink supports both vertical and horizontal mounting directions, offering flexibility in circuit board design. This component is ideal for various board-level cooling applications and requires a separate mounting kit for device attachment.
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SPECIFICATIONS
IN STOCK: 24,481
Ships today, if you order in
Minimum Order Quantity: 25
Factory Lead-Time 6 Weeks
Price (USD)
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