532702B02500G by boyd laconia llc
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Boyd Laconia LLC Authorized Distributor

532702B02500G

The 532702B02500G is an extruded aluminum, dual radial board-level heat sink designed for cooling TO-220 and TO-220-single gauge devices. ...

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RoHS Compliant
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Certificate of Compliance

DESCRIPTION

The 532702B02500G is a dual radial, board-level heat sink from the High Power Extruded 5320 series, intended for thermal management of electronic components. It is specifically designed to cool TO-220 and TO-220-single gauge semiconductor devices. Constructed from aluminum with a black anodize finish for durability and thermal performance, this heat sink measures 41.91 mm in width, 25.40 mm in length, and has a height of 50.80 mm. Designed for vertical mounting on a printed circuit board, it is ideal for high-power applications where efficient heat dissipation from power transistors or regulators is critical to ensure system reliability.

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SPECIFICATIONS

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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
532702B02500G
Alias/AKA:
041699
Unit of Measure:
Per Each
RoHS:
Yes
COO:
CN
ECCN:
EAR99
Supplier's Standard Package: The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution.
1
Device Cooled:
TO-2206707
Attachment Method:
N/A
Dimension:
41.91 x 25.4 x 50.86714mm
Thermal Resistance:
4.86717°C/W
Finish:
Black Anodized6710

IN STOCK: 2,920

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Minimum Order Quantity: 5

Factory Lead-Time 9 Weeks

Price (USD)

Qty
Unit Price
5
$6.65
25
$6.11
100
$5.83
250
$5.53
500
$5.33
1,000
$5.13
3,000
$5.11
5,000 +
$5.08
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