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6396BG by boyd laconia llc
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6396BG

Boyd Laconia LLC

The 6396BG is a high-power extruded heat sink with large radial fins designed for thermal management of semiconductor packages. ...

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RoHS Compliant
Packaging
Accessories
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DESCRIPTION

The 6396BG is a high-power extruded heat sink designed for effective heat dissipation from electronic components. It features large radial fins and is specifically intended for use with TO-220 and TO-218 packages. This heat sink has a thermal resistance of 5.60 °C/W, based on a 75°C temperature rise in natural convection. Finished with black anodize to enhance radiative cooling, it is ideal for applications requiring reliable thermal performance to maintain component longevity and stability.

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SPECIFICATIONS

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Supplier:
Boyd Laconia LLC
Part No:
6396BG
Alias/AKA:
041507
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8473309000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
360

IN STOCK: 0

On Order: 3,733   can ship 5/14/26 

Minimum Order Quantity: 5

Factory Lead-Time 15 Weeks

Price (USD)

Qty
Unit Price
5
$5.25
50
$3.31
100
$3.10
360
$2.74
720
$2.73
1,080
$2.67
2,520 +
$2.62
Suppliers Standard Package
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