7141DG by boyd laconia llc
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Boyd Laconia LLC Authorized Distributor

7141DG

Heat Sink Passive TO-220 Vertical Thru-Hole Copper 20.3A°C/W Matte Tin ...

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RoHS Compliant
Bulk Packaging
Accessories
Certificate of Compliance

DESCRIPTION

The 7141DG is a narrow channel board level heat sink engineered to cool TO-220 and TO-220-single gauge semiconductor devices. Constructed from copper with a tin-plated finish, it features an integrated mounting clip for secure device attachment and is mounted vertically on the board. The heat sink measures 13.21 mm in width, 13.08 mm in length, and 19.81 mm in height, with dimensional specifications including a "y" dimension of 0.33 mm and a "z" dimension of 2.77 mm. This compact design provides effective thermal management for power devices, with thermal performance varying based on air velocity, making it suitable for applications requiring efficient heat dissipation in space-constrained environments. The product is RoHS compliant, ensuring environmental and regulatory compliance.

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SPECIFICATIONS

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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
7141DG
Alias/AKA:
042648
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8536694040
COO:
CN
ECCN:
EAR99
Supplier's Standard Package: The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution.
3500
Package Type:
Bulk
Device Cooled:
TO-2206707
Attachment Method:
Clip/Solder Tab6706
Dimension:
13.21 x 13.08 x 19.816714mm
Thermal Resistance:
20.36717°C/W
Finish:
Matte Tin6710

IN STOCK: 3,188

Can Ship immediately

MOQ for In Stock Qty: 10

MOQ for out of Stock Qty: 875

Factory Lead-Time 6 Weeks

Price (USD)

Qty
Unit Price
10
$1.148
250
$0.981
500
$0.931
875
$0.924
1,750
$0.920
2,625
$0.917
3,500 +
$0.915
Supplier's Standard Package
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