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374624B00032G by boyd laconia llc
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374624B00032G

Boyd Laconia LLC

Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4A°C/W Black Anodized

Datasheet
RoHS Compliant
Packaging
Accessories
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DESCRIPTION

Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4A°C/W Black Anodized

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SPECIFICATIONS

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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
374624B00032G
Alias/AKA:
043181
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8419505000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
510
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Tape6706
Dimension:
35 x 35 x 106714mm
Thermal Resistance:
23.46717°C/W
Finish:
Black Anodized6710

IN STOCK: 769

Ships today, if you order in

Minimum Order Quantity: 10

Factory Lead-Time 6 Weeks

Price (USD)

Qty
Unit Price
10
$2.52
50
$2.30
250
$2.20
510
$2.16
1,020
$2.11
2,550
$2.04
5,100
$2.01
7,650 +
$2.00
Suppliers Standard Package
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