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374724B60024G by boyd laconia llc
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374724B60024G

Boyd Laconia LLC

Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3A°C/W Black Anodized

Datasheet
RoHS Compliant
Packaging
Accessories
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DESCRIPTION

Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3A°C/W Black Anodized

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SPECIFICATIONS

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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
374724B60024G
Alias/AKA:
306220
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8542900000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
168
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Solder Anchor6706
Dimension:
35 x 35 x 186714mm
Thermal Resistance:
15.36717°C/W
Finish:
Black Anodized6710

IN STOCK: 1,412

Can Ship immediately

Minimum Order Quantity: 10

Factory Lead-Time 6 Weeks

Price (USD)

Qty
Unit Price
10
$4.30
50
$3.49
168
$3.34
336
$3.24
504
$3.06
1,008
$2.91
2,520
$2.69
5,040 +
$2.66
Suppliers Standard Package
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