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374724B60024G by boyd laconia llc

374724B60024G

Boyd Laconia LLC

Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3A°C/W Black Anodized

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RoHS Compliant
Packaging
Accessories
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DESCRIPTION

Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3A°C/W Black Anodized

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SPECIFICATIONS

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Supplier:
Boyd Laconia LLC
Part No:
374724B60024G
RoHS:
Yes
HTS:
8542900000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack:  This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
168
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Solder Anchor6706
Dimension:
35 x 35 x 186714mm
Thermal Resistance:
15.36717°C/W
Finish:
Black Anodized6710

IN STOCK: 1,682

Ships today, if you order in

Minimum Order: 5

Factory Lead-Time 6 Weeks

Price (USD)

Qty
Unit Price
5
$5.871
50
$5.068
168
$4.687
336
$4.666
504
$4.645
1,008
$4.614
2,520
$4.594
5,040 +
$4.573
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