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375324B00035G by boyd laconia llc

375324B00035G

Boyd Laconia LLC

Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized ...

RoHS Compliant
Bulk Packaging
Accessories
This product is backed by Electro Sonic' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee

DESCRIPTION

The AAVID THERMALLOY part 375324B00035G is a high-quality, passive heat sink designed to effectively dissipate heat from BGA and FPGA components. It features an extruded adhesive aluminum construction which ensures excellent thermal conductivity and durability. With a thermal resistance of 71.4°C/W, this heat sink efficiently prevents overheating and enables optimal performance of electronic devices. Its black anodized finish not only enhances aesthetics but also provides enhanced corrosion resistance. Invest in this reliable and efficient heat sink for improved thermal management and prolonged component lifespan.

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SPECIFICATIONS

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Supplier:
Boyd Laconia LLC
Part No:
375324B00035G
RoHS:
Yes
HTS:
8542900000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack:  This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1
Package Type:
Bulk
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Tape6706
Dimension:
10.2 x 10.2 x 10.26714mm
Thermal Resistance:
71.46717°C/W
Finish:
Black Anodized6710

IN STOCK: 3,316

Ships today, if you order in

MOQ for In Stock Qty: 5

MOQ for out of Stock Qty: 480

Factory Lead-Time 9 Weeks

Price (CAD)

Qty
Unit Price
5
$7.176
100
$5.568
250
$5.195
480
$5.087
960
$4.848
1,440
$4.691
1,920 +
$4.667
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Please Note: Tariffs may apply for U.S. shipments

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