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375424B00034G by boyd laconia llc

375424B00034G

Boyd Laconia LLC

Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5A°C/W Black Anodized

Datasheet
RoHS Compliant
Bulk Packaging
Accessories
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DESCRIPTION

Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5A°C/W Black Anodized

Search Keywords: 375424B00034G

SPECIFICATIONS

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Supplier:
Boyd Laconia LLC
Part No:
375424B00034G
RoHS:
Yes
HTS:
8542900000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack:  This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
3360
Package Type:
Bulk
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Tape6706
Dimension:
15.2 x 15.2 x 6.356714mm
Thermal Resistance:
62.56717°C/W
Finish:
Black Anodized6710

IN STOCK: 576

Ships today, if you order in

Minimum Order: 25

Factory Lead-Time 6 Weeks

Price (CAD)

Qty
Unit Price
25
$1.719
250
$1.230
500
$1.185
1,000
$1.180
3,360
$1.174
6,720
$1.169
10,080
$1.163
16,800 +
$1.157
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