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375424B00034G by boyd laconia llc
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375424B00034G

Boyd Laconia LLC

The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices. ...

Datasheet
RoHS Compliant
Bulk Packaging
Accessories
This product is backed by Electro Sonic' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee

DESCRIPTION

The 375424B00034G is a square pin fin, board-level heat sink intended for the thermal management of BGA and FPGA components. Constructed from aluminum with a black anodize finish, this heat sink measures 15.20 mm in width, 15.30 mm in length, and 6.35 mm in height. It supports both horizontal and vertical mounting orientations for flexible integration. For secure installation and effective thermal transfer, it comes with pre-applied T410R Chomerics thermal tape. This RoHS compliant heat sink is an effective cooling solution for densely packed electronic assemblies requiring heat dissipation for surface-mount devices.

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SPECIFICATIONS

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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
375424B00034G
Alias/AKA:
042987
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8542900000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
3360
Package Type:
Bulk
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Tape6706
Dimension:
15.2 x 15.2 x 6.356714mm
Thermal Resistance:
62.56717°C/W
Finish:
Black Anodized6710

IN STOCK: 3,654

Can Ship immediately

MOQ for In Stock Qty: 25

MOQ for out of Stock Qty: 840

Factory Lead-Time 6 Weeks

Price (USD)

Qty
Unit Price
25
$1.832
250
$1.827
500
$1.823
840
$1.818
1,680
$1.119
2,520
$0.886
3,360 +
$0.868
Supplier's Standard Package
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