4951G
Boyd Laconia LLCAdhesive - Thermal - Epoxy - Black - 1.34 W/m.K - 9200 psi - Bag. ...
DESCRIPTION
The 4951G is a 3.5oz Thermal Bond Compound, created using a two part epoxy resin system. It provides exceptional adhesion to copper, aluminum, steel, glass, ceramics and most plastics while possessing a coefficient of thermal expansion that is extremely compatible with aluminum, copper and brass. Once cured, thermal bond is exceptionally resistant to environmental hazards.
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SPECIFICATIONS
IN STOCK: 0
Factory Lead-Time 16 Weeks
Price (USD)
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