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513202B02500G by boyd laconia llc
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513202B02500G

Boyd Laconia LLC

The 513202B02500G is an extruded aluminum, dual radial board-level heat sink designed for cooling TO-220 semiconductor devices. ...

Datasheet
RoHS Compliant
Bulk Packaging
Accessories
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DESCRIPTION

The 513202B02500G is a dual radial, board-level heat sink from the Extruded 5000 series, specifically designed for the thermal management of TO-220 packaged devices. Constructed from aluminum with a black anodize finish for durability and thermal performance, this heat sink measures 50.80 mm in height and 34.92 mm in width. It features solderable pins for secure board attachment and can be mounted in either a horizontal or vertical orientation. This component is ideal for applications requiring efficient heat dissipation from power components on a printed circuit board, ensuring device reliability and performance.

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SPECIFICATIONS

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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
513202B02500G
Alias/AKA:
041497
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8473305100
COO:
IN
ECCN:
EAR99
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1000
Package Type:
Bulk
Device Cooled:
TO-2206707
Attachment Method:
Solder Pin6706
Dimension:
34.92 x 12.7 x 50.86714mm
Thermal Resistance:
96717°C/W
Finish:
Black Anodized6710

IN STOCK: 0

Minimum Order Quantity: 5

Factory Lead-Time 8 Weeks

Price (USD)

Qty
Unit Price
5
$6.96
25
$5.84
100
$5.40
250
$5.17
500
$4.95
1,000
$4.82
3,000
$4.64
5,000 +
$4.62
Suppliers Standard Package
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