593202B03500G by boyd laconia llc
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Boyd Laconia LLC Authorized Distributor

593202B03500G

The 593202B03500G is a staggered fin, board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices. ...

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RoHS Compliant
Bulk Packaging
Accessories
Certificate of Compliance

DESCRIPTION

The 593202B03500G is a board-level heat sink from the Space Saving 5932 series, engineered for thermal management of TO-220 and TO-220-single gauge devices. Constructed from aluminum with a black anodize finish for durability and performance, it measures 35.05 mm in width, 12.20 mm in length, and 50.80 mm in height. This component features a staggered fin design for efficient heat dissipation and is intended for vertical mounting. It is ideal for applications requiring effective cooling of power components in space-constrained board-level environments and requires a separate mounting kit for device attachment.

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SPECIFICATIONS

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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
593202B03500G
Alias/AKA:
042686
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8473309000
COO:
CN
ECCN:
EAR99
Supplier's Standard Package: The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution.
800
Package Type:
Bulk
Device Cooled:
TO-220
Attachment Method:
N/A
Dimension:
35.05 x 12.2 x 50.8mm
Thermal Resistance:
10.4 °C/W
Finish:
Black Anodized

IN STOCK: 7,656

Ships today, if you order in

MOQ for In Stock Qty: 5

MOQ for out of Stock Qty: 400

Factory Lead-Time 6 Weeks

Price (USD)

Qty
Unit Price
5
$1.36
100
$1.19
250
$1.18
400
$1.15
800
$1.14
1,200
$1.13
1,600 +
$1.12
Supplier's Standard Package
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