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7173DG by boyd laconia llc
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7173DG

Boyd Laconia LLC

Heat Sink Passive TO-220 Thru-Hole Copper 25.8°C/W Tin ...

Datasheet
RoHS Compliant
Bulk Packaging
Accessories
This product is backed by Electro Sonic' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee

DESCRIPTION

7173DG is a channel board level heat sink designed to cool TO-220 and TO-220-single gauge devices. Constructed from copper with a tin-plated finish, this heat sink features dimensions of 19.05 mm width, 9.52 mm length, and 19.05 mm height with vertical mounting orientation. The design includes a 3.81 mm through-hole and specific mounting dimensions with X dimension of 9.22 mm, Y dimension of 4.11 mm, and Z dimension of 2.54 mm. This RoHS compliant heat sink requires a mounting kit for device attachment and is ideal for board level thermal management applications where efficient heat dissipation from power semiconductors is required.

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SPECIFICATIONS

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Supplier:
Boyd Laconia LLC
Part No:
7173DG
Alias/AKA:
043243
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8536694040
COO:
CN
ECCN:
EAR99
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
3000
Package Type:
Bulk
Device Cooled:
TO-220
Attachment Method:
N/A
Dimension:
19.05 x 9.52 x 19.05 mm
Thermal Resistance:
25.8 °C/W
Finish:
Tin

IN STOCK: 12,172

Can Ship immediately

Minimum Order Quantity: 10

Factory Lead-Time 6 Weeks

Price (USD)

Qty
Unit Price
10
$2.464
50
$2.458
250
$0.646
500
$0.621
1,000
$0.603
3,000
$0.602
6,000
$0.599
9,000 +
$0.598
Suppliers Standard Package
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