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ENC28J60-I/ML by microchip technology

ENC28J60-I/ML

Microchip Technology

Ethernet Controller - 10 Mbps - 3.3V - QFN - Tube - 28-Pin. ...

RoHS Compliant

TUBE Packaging

DESCRIPTION

The ENC28J60-I/ML is a stand-alone Ethernet Controller with an industry standard serial peripheral interface (SPI). It is designed to serve as an Ethernet network interface for any controller equipped with SPI. The ENC28J60 meets all of the IEEE 802.3 specifications. It incorporates a number of packet filtering schemes to limit incoming packets. It also provides an internal DMA module for fast data throughput and hardware assisted checksum calculation, which is used in various network protocols. Communication with the host controller is implemented via an interrupt pin and the SPI, with clock rates of up to 20MHz. Two dedicated pins are used for LED link and network activity indication.

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Search Keywords: ENC28J60IML

SPECIFICATIONS

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Products found: 0

Supplier:

Microchip Technology

Part No:

ENC28J60-I/ML

RoHS:

Yes

HTS:

8542390090

COO:

TH

ECCN:

EAR99

Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

61

Package Type:

TUBE

Auto-Negotiation:

No

Dimension:

6 x 6 x 0.88 mm

Data Rate:

10 Mbps

Communication Mode:

Full Duplex,Half Duplex

Category:

Single Chip

Different packaging options available. See Alternatives

IN STOCK: 423

Ships today, if you order in

BONDED Quantity: 0

Manufacturer Stock: 27,111 can ship 12/5/25

Minimum Order: 5

Available in less than min:

MOQ for out of Stock Qty:

Multiple: 1

Factory Lead-Time 4 Weeks can ship 12/18/25

This product is no longer being manufactured but there may be alternatives. We can help you, Contact Us.

Price (CAD)

Qty

Unit Price

5

$7.136

61

$5.788

122

$5.452

305

$5.421

549

$5.391

1,037

$5.374

2,501

$5.345

5,002 +

$5.313

Suppliers Standard Package

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Tools/3D Models

Product Guides

Product Changes

PCN - 27-Mar-2009 - Microchip is cancelling the previously announced CCB#848 as the current production demand for 28L QF

PCN - 16-Feb-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE

PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 12-Feb-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 04-May-2015 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES

PCN - 08-Nov-2010 - QUALIFICATION OF 28L QFN (6X6) PACKAGE AT ASAC (UTAC) ASSEMBLY SITE.

PCN - 30-Jul-2012 - Microchip has released a new devicedoc for the listed ENC28J60 stand-alone ethernet controller with

PCN - 22-Jul-2008 - QUALIFICATION OF UTAC THAI LIMITED (UTL) TO TEST 28QFN (6X6) PACKAGED PRODUCTS

PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 25-Jun-2015 - CANCELLATION NOTICE: QUALIFICATION OF SELECTED PRODUCTS WITH PDCU BOND WIRE AT MTAI SITE

PCN - 30-Jul-2012 - ENC28J60 STAND-ALONE ETHERNET CONTROLLER WITH SPI INTERFACE DATA SHEET DOCUMENT REVISION

PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

PCN - 09-Jan-2014 - Microchip is announcing the qualification the listed products with palladium coated copper (PdCu) bo

PCN - 20-Jul-2015 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES

PCN - 31-Oct-2014 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES

PCN - 27-Oct-2008 - QUALIFICATION OF 28L QFN PACKAGE (6X6X0.9MM) AT ATP ASSEMBLY

PCN - 10-Sep-2008 - Microchip is announcing the qualification of new assembly site for 28L QFN (6X6X0.9MM) package dsPIC

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 28-Jun-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).

PCN - 30-Jul-2012 - ENC28J60 STAND-ALONE ETHERNET CONTROLLER WITH SPI INTERFACE DATA SHEET DOCUMENT REVISION

PCN - 26-Dec-2013 - Microchip is announcing the qualification of the listed 28L QFN (6x6x0.9mm and 5x5x0.9mm), 20L QFN (

PCN - 12-Feb-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 10-Sep-2008 - NEW ASSEMBLY SITE

PCN - 28-Jan-2014 - QUALIFICATION OF 28L QFN, 20L QFN AND 16L QFN PACKAGES AT MTAI ASSEMBLY SITE

PCN - 10-Sep-2008 - QUALIFICATION OF 28L QFN (6X6X0.9MM) PACKAGE AT ASAT LIMITED, CHINA (ASAC) ASSEMBLY

PCN - 01-Apr-2014 - QUALIFICATION OF SELECTED PRODUCTS IN 28L QFN, 20L QFN & 16L QFN WITH PDCU BOND WIRE AT MTAI SITE

PCN - 07-Mar-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI

PCN - 06-Feb-2008 - Qualification of CRM1706DJ die attach EPOXY and G770HCD mold compound for 20L QFN (4X4), 28L QFN (6X

PCN - 06-Feb-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

PCN - 16-Jan-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS OF 0.25UM TSMC WAFER TECHN

PCN - 08-Mar-2007 -

PCN - 25-Jun-2015 - CANCELLATION NOTICE: QUALIFICATION OF SELECTED PRODUCTS WITH PDCU BOND WIRE AT MTAI SITE

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 20-Jul-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE

PCN - 12-Dec-2012 - Microchip has released a new devicedoc for the ENC28J60 stand-alone ethernet controller with SPI int

PCN - 12-Dec-2012 - ENC28J60 STAND-ALONE ETHERNET CONTROLLER WITH SPI INTERFACE

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 24-May-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 08-Nov-2010 - Microchip is announcing the qualification of 28L QFN (6x6) package at ASAC (UTAC) assembly site in o

PCN - 27-Mar-2009 - PCN CCB#848 CANCELLED

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 21-Jul-2008 - Microchip is announcing the qualification of 28L QFN package (6X6X0.9mm) at ATP Assembly in order to

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 16-Feb-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE

PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 21-Jul-2008 - QUALIFICATION OF 28L QFN PACKAGE (6X6X0.9 MM) AT ATP ASSEMBLY

PCN - 01-Feb-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 04-May-2015 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES

PCN - 28-Jan-2014 - Microchip is announcing the qualification of 28L QFN (6x6x0.9mm and 5x5x0.9mm), 20L QFN (5x5x0.9mm a

PCN - 12-Dec-2012 - DATA SHEET - ENC28J60 STAND-ALONE ETHERNET CONTROLLER WITH SPI INTERFACE

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 01-Apr-2014 - QUALIFICATION OF SELECTED PRODUCTS IN 28L QFN, 20L QFN & 16L QFN WITH PDCU BOND WIRE AT MTAI SITE

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 22-Jul-2008 - Microchip is announcing the qualification of UTAC THAI LIMITED (UTL) as a new test site for 28QFN (6

PCN - 26-Dec-2013 - QUALIFICATION OF 28L QFN, 20L QFN AND 16L QFN PACKAGES AT MTAI ASSEMBLY SITE

PCN - 25-Jun-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 01-Feb-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 20-Jul-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE

PCN - 20-Apr-2011 - QUALIFICATION OF 28L QFN (6X6) PACKAGE AT ASAC (UTAC) ASSEMBLY SITE

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

ALTERNATIVE PRODUCTS

Alternative Packaging
In Stock: 1600
Minimum Order Quantity: 100

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