HSB03-121218
Same Sky®’s12 x 12 mm - BGA Heat Sink - Aluminum - PCB ...
DESCRIPTION
HSB03-121218 is a BGA-design heat sink engineered for efficient thermal dissipation in compact electronic assemblies. Constructed from AL 6063-T5 aluminum alloy with a black anodized finish, it features a small footprint optimized for space-constrained applications. The heat sink demonstrates thermal resistance of 25.88°C/W at 75°C temperature differential under natural convection, with improved performance of 8.9°C/W at 200 LFM and 6.4°C/W at 400 LFM airflow, enabling power dissipation up to 2.9 W under natural convection conditions. With a weight of 6.4 g and RoHS compliance, this heat sink is ideal for high-density PCB layouts requiring reliable thermal management without adding significant mass or complexity.
Search Keywords: HSB03121218
SPECIFICATIONS
IN STOCK: 295
Ships today, if you order in
On Order:
2,640
can ship 7/16/26
Minimum Order Quantity: 50
Factory Lead-Time 14 Weeks
Price (USD)
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