DESCRIPTION

1-1825376-3 is a standard DIP socket assembly featuring a ladder frame design with DIPLOMATE DL (Dual Leaf) contact technology. The socket accommodates 40 positions with a 2.54 mm centerline spacing and 15.49 mm row-to-row spacing, providing reliable through-hole termination for vertical mounting on printed circuit boards. Key electrical characteristics include 10,000 MO insulation resistance and 30 mO contact resistance, with beryllium copper contacts plated in gold (30 µm) for superior mating performance. The housing is constructed from thermoplastic material with glass fiber reinforcement (UL 94V-0 rated), and the socket features a 5.33 mm height above the PCB with 3.05 mm termination post length. This socket is RoHS and ELV compliant, wave solder capable to 265°C, and operates reliably at temperatures up to 125°C, making it suitable for automated insertion and production applications requiring robust IC socket solutions.